This part of IEC 61 1 91 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).
![IEC 61191-4:2017](https://www.365standards.com/wp-content/uploads/2023/02/IEC-61191-4-2017.png)