This part of IEC 6031 7 specifies the requirements of solderable enamelled round copper winding wire of class 1 80 with a dual coating. The underlying coating is based on polyesterimide resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin.
NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics.
The range of nominal conductor diameters covered by this part is:
– Grade 1 B: 0,020 mm up to and including 1 ,600 mm;
– Grade 2B: 0,020 mm up to and including 1 ,600 mm.
The nominal conductor diameters are specified in Clause 4 of IEC 6031 7-0-1 :201 3.
