This part of IEC 6031 7 specifies the requirements of solderable enamelled round copper winding wire of class 1 80 with a dual coating. The underlying coating is based on polyester- imide resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin.
NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics.
The range of nominal conductor diameters covered by this part is:
– Grade 1 B: 0,020 mm up to and including 1 ,600 mm;
– Grade 2B: 0,020 mm up to and including 1 ,600 mm.
The nominal conductor diameters are specified in Clause 4 of IEC 6031 7-0-1 :201 3.
