This part of IEC 6031 7 specifies the requirements of solderable enamelled round copper winding wire of class 1 55 with a dual coating. The underlying coating is based on poly- urethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin.
NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics.
The range of nominal conductor diameters covered by this standard is:
– Grade 1 B: 0,020 mm up to and including 0,800 mm;
– Grade 2B: 0,020 mm up to and including 0,800 mm.
The nominal conductor diameters are specified in Clause 4 of IEC 6031 7-0-1 :201 3.
