This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068 ‑2‑58.
This document provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.
The procedures in this document include the solder bath method and soldering iron method.
The objective of this document is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition,test methods are provided to ensure that the component body can be resistant to the heat load to which it is exposed during soldering.
NOTE Information about wetting time and wetting force can be obtained by test methods using a wetting balance.
IEC 60068-2-69 (solder bath and solder globule method) can be consulted.
